Staff Engineer Unit Process Development

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Responsibilities Establish new assembly process capabilities for molding process.
Identify process deviations and implement corrective actions.
Support package development projects and lead platform extensions/innovation projects.
Perform data gathering and statistical analysis to confirm process stability.
Conduct process knowledge transfer to manufacturing teams.
Ensure lessons learned are well documented.
Proactively propose solutions to ensure best-in-class time to market for Infineon products.
Qualifications Master or Bachelor Degree in Mechanical, Materials, or Process Engineering.
Minimum 5 years of experience in IC/Semiconductor assembly industry.
In-depth knowledge of molding processes, equipment, and materials.
Independent with good communication and coordination skills.
Leadership ability in problem-solving.
Analytical mindset and high initiative.
Knowledge of IC Packaging Assembly Process Flow.
Experience with analytical tools (JMP, 8D, FMEA, SPC, DMAIC) and design of experiments.
Structured problem-solving skills.
About Infineon We are in for driving decarbonization and digitalization.
As a global leader in semiconductor solutions, Infineon enables solutions for green energy, clean mobility, and smart IoT.
We foster innovation, customer success, and a supportive work environment that values diversity and inclusion.
Additional Information Seniority level: Mid-Senior level Employment type: Full-time Industries: Semiconductor Manufacturing, Appliances, Electrical, Electronics, and Computer Hardware Manufacturing #J-18808-Ljbffr